How to deal with chip-package, package-board and board-system interactions for future electronic systems reliability

dc.contributor.author	Vandevelde, Bart
dc.contributor.imecauthor	Vandevelde, Bart
dc.contributor.orcidimec	Vandevelde, Bart::0000-0002-6753-6438
dc.date.accessioned	2021-10-27T21:45:25Z
dc.date.available	2021-10-27T21:45:25Z
dc.date.issued	2019
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/34303
dc.source.conference	Trends and Challenges in Reliability: from components to systems
dc.source.conferencedate	9/05/2019
dc.source.conferencelocation	Eindhoven Nederland
dc.title	How to deal with chip-package, package-board and board-system interactions for future electronic systems reliability
dc.type	Oral presentation
dspace.entity.type	Publication
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