Publication:

RF characterization of mold compound materials and high-Q passives integrated using fan-out wafer-level packaging technology

Date

2019
Proceedings Paper
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dc.contributor.authorSun, Xiao
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorMiller, Andy
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorSun, Xiao
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-27T19:13:53Z
dc.date.available2021-10-27T19:13:53Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34086
dc.identifier.urlhttps://www.conftool.net/eptc2019/index.php?page=browseSessions&print=yes&doprint=yes&form_session=166
dc.source.conferenceEPTC
dc.source.conferencedate4/12/2019
dc.source.conferencelocationSingapore Singapore
dc.title

RF characterization of mold compound materials and high-Q passives integrated using fan-out wafer-level packaging technology

dc.typeProceedings paper
dspace.entity.typePublication
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