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High density interconnect substrates using multilayer thin film technology on laminate substrates (MCM-SUD)

Date

2000
Proceedings Paper
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dc.contributor.authorBeyne, Eric
dc.contributor.authorVan Hoof, Rita
dc.contributor.authorWebers, Tomas
dc.contributor.authorRossi, S.
dc.contributor.authorLechleiter, F.
dc.contributor.authorDi Ianni, M.
dc.contributor.authorOstmann, A.
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVan Hoof, Rita
dc.contributor.imecauthorWebers, Tomas
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-14T12:41:00Z
dc.date.available2021-10-14T12:41:00Z
dc.date.embargo9999-12-31
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4120
dc.source.beginpage229
dc.source.conferenceProceedings 2000 International Symposium on Microelectronics
dc.source.conferencedate18/09/2000
dc.source.conferencelocationBoston, MA USA
dc.source.endpage234
dc.title

High density interconnect substrates using multilayer thin film technology on laminate substrates (MCM-SUD)

dc.typeProceedings paper
dspace.entity.typePublication
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