Study of out-of-plane mechanical stress impact on Si BJT and diffusion resistor using in-situ nanoindentation probing

dc.contributor.author	Liu, Yefan
dc.contributor.author	Hiblot, Gaspard
dc.contributor.author	Furuhashi, Takahisa
dc.contributor.author	Lin, Hesheng
dc.contributor.author	Velenis, Dimitrios
dc.contributor.author	De Wolf, Ingrid
dc.contributor.imecauthor	Liu, Yefan
dc.contributor.imecauthor	Hiblot, Gaspard
dc.contributor.imecauthor	Furuhashi, Takahisa
dc.contributor.imecauthor	Lin, Hesheng
dc.contributor.imecauthor	Velenis, Dimitrios
dc.contributor.imecauthor	De Wolf, Ingrid
dc.contributor.orcidimec	Hiblot, Gaspard::0000-0002-3869-965X
dc.contributor.orcidimec	Lin, Hesheng::0000-0002-7404-3156
dc.contributor.orcidimec	De Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned	2021-10-27T12:50:23Z
dc.date.available	2021-10-27T12:50:23Z
dc.date.issued	2019
dc.identifier.issn	0026-2714
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/33461
dc.identifier.url	https://doi.org/10.1016/j.microrel.2019.06.059
dc.source.beginpage	113367
dc.source.journal	Microelectronics Reliability
dc.source.volume	100-101
dc.title	Study of out-of-plane mechanical stress impact on Si BJT and diffusion resistor using in-situ nanoindentation probing
dc.type	Journal article
dspace.entity.type	Publication
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