Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Conference contributions
High curvature bending characterization of ultra-thin chips and chip-on-foil assemblies
Publication:
High curvature bending characterization of ultra-thin chips and chip-on-foil assemblies
Copy permalink
Date
2013
Proceedings Paper
Simple item page
Full metadata
Statistics
Loading...
Loading...
Files
29424.pdf
2.28 MB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
van den Ende, Daan
;
Verhoeven, Frits
;
van der Eijnden, Pepijn
;
Kusters, Roel
;
Sridhar, Ashok
;
Cauwe, Maarten
;
van den Brand, Jeroen
Journal
Abstract
Description
Metrics
Views
1928
since deposited on 2021-10-21
3
last month
Acq. date: 2025-12-10
Citations
Metrics
Views
1928
since deposited on 2021-10-21
3
last month
Acq. date: 2025-12-10
Citations