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SLIM-cut thin silicon wafering with enhanced crack and stress control

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dc.contributor.authorVaes, Jan
dc.contributor.authorMasolin, Alex
dc.contributor.authorPesquera Rodriguez, Amaia
dc.contributor.authorDross, Frederic
dc.date.accessioned2021-10-18T22:37:48Z
dc.date.available2021-10-18T22:37:48Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18123
dc.source.beginpage777212
dc.source.conferenceNext Generation (Nano) Photonic and Cell Technologies for Solar Energy
dc.source.conferencedate2/08/2010
dc.source.conferencelocationSan Diego, CA USA
dc.title

SLIM-cut thin silicon wafering with enhanced crack and stress control

dc.typeProceedings paper
dspace.entity.typePublication
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