Publication:

Development and Characterization of Electrodeposited Tin-Indium Alloy Microbumps for Low Temperature Assembly

Date

2025
Proceedings Paper
https://doi.org/10.1109/ECTC51687.2025.00328
Simple item page Full metadata Statistics
 
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0003-4042-0942
cris.virtual.orcid0000-0002-6699-1615
cris.virtual.orcid0000-0002-6782-5424
cris.virtual.orcid0000-0003-2448-9165
cris.virtual.orcid0000-0001-6125-5793
cris.virtualsource.department4c93cccf-a755-43b9-b745-1b88ec460529
cris.virtualsource.department12de27c7-869f-445c-8ac5-1dad7854aab4
cris.virtualsource.department71656083-4e54-41a6-8b58-909e9d5aed91
cris.virtualsource.departmente506cc22-f003-4f27-bc24-12771348f7aa
cris.virtualsource.department341deb29-7342-4489-8005-d09096dfb766
cris.virtualsource.orcid4c93cccf-a755-43b9-b745-1b88ec460529
cris.virtualsource.orcid12de27c7-869f-445c-8ac5-1dad7854aab4
cris.virtualsource.orcid71656083-4e54-41a6-8b58-909e9d5aed91
cris.virtualsource.orcide506cc22-f003-4f27-bc24-12771348f7aa
cris.virtualsource.orcid341deb29-7342-4489-8005-d09096dfb766
dc.contributor.authorDobrovolska, Tsvetina
dc.contributor.authorMack, Martin
dc.contributor.authorLeyendecker, Klaus
dc.contributor.authorMartin, Kevin
dc.contributor.authorRadisic, Alex
dc.contributor.authorShafahian, Ehsan
dc.contributor.authorMudigere Krishne Gowda, Punith
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorStruyf, Herbert
dc.date.accessioned2026-03-31T09:16:38Z
dc.date.available2026-03-31T09:16:38Z
dc.date.createdwos2025-10-31
dc.date.issued2025
dc.description.abstractThe newly developed tin-indium (Sn-In) electrolyte enables the electrochemical deposition of eutectic and neareutectic Sn-In alloys containing 45-55 wt.% indium. The reflow process was successfully conducted at temperatures below 150∘C, approaching the eutectic melting point of Sn -In and remaining lower than the melting temperature of pure indium. Additionally, the results of the preliminary bonding tests are presented, demonstrating the potential of this electrolyte for lowtemperature assembly applications.
dc.identifier.doi10.1109/ECTC51687.2025.00328
dc.identifier.isbn979-8-3315-3933-7
dc.identifier.issn0569-5503
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/58989
dc.language.isoeng
dc.provenance.editstepusergreet.vanhoof@imec.be
dc.publisherIEEE COMPUTER SOC
dc.source.beginpage1924
dc.source.conferenceIEEE 75th Electronic Components and Technology Conference (ECTC)
dc.source.conferencedate2025-05-27
dc.source.conferencelocationDallas
dc.source.endpage1928
dc.source.journal2025 IEEE 75TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC
dc.source.numberofpages5
dc.title

Development and Characterization of Electrodeposited Tin-Indium Alloy Microbumps for Low Temperature Assembly

dc.typeProceedings paper
dspace.entity.typePublication
imec.internal.crawledAt2025-10-22
imec.internal.sourcecrawler
Files
Publication available in collections:
Conference contributions