Publication:
Development and Characterization of Electrodeposited Tin-Indium Alloy Microbumps for Low Temperature Assembly
| dc.contributor.author | Dobrovolska, Tsvetina | |
| dc.contributor.author | Mack, Martin | |
| dc.contributor.author | Leyendecker, Klaus | |
| dc.contributor.author | Martin, Kevin | |
| dc.contributor.author | Radisic, Alex | |
| dc.contributor.author | Shafahian, Ehsan | |
| dc.contributor.author | Mudigere Krishne Gowda, Punith | |
| dc.contributor.author | Derakhshandeh, Jaber | |
| dc.contributor.author | Struyf, Herbert | |
| dc.date.accessioned | 2026-03-31T09:16:38Z | |
| dc.date.available | 2026-03-31T09:16:38Z | |
| dc.date.createdwos | 2025-10-31 | |
| dc.date.issued | 2025 | |
| dc.description.abstract | The newly developed tin-indium (Sn-In) electrolyte enables the electrochemical deposition of eutectic and neareutectic Sn-In alloys containing 45-55 wt.% indium. The reflow process was successfully conducted at temperatures below 150∘C, approaching the eutectic melting point of Sn -In and remaining lower than the melting temperature of pure indium. Additionally, the results of the preliminary bonding tests are presented, demonstrating the potential of this electrolyte for lowtemperature assembly applications. | |
| dc.identifier.doi | 10.1109/ECTC51687.2025.00328 | |
| dc.identifier.isbn | 979-8-3315-3933-7 | |
| dc.identifier.issn | 0569-5503 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/58989 | |
| dc.language.iso | eng | |
| dc.provenance.editstepuser | greet.vanhoof@imec.be | |
| dc.publisher | IEEE COMPUTER SOC | |
| dc.source.beginpage | 1924 | |
| dc.source.conference | IEEE 75th Electronic Components and Technology Conference (ECTC) | |
| dc.source.conferencedate | 2025-05-27 | |
| dc.source.conferencelocation | Dallas | |
| dc.source.endpage | 1928 | |
| dc.source.journal | 2025 IEEE 75TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC | |
| dc.source.numberofpages | 5 | |
| dc.title | Development and Characterization of Electrodeposited Tin-Indium Alloy Microbumps for Low Temperature Assembly | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| imec.internal.crawledAt | 2025-10-22 | |
| imec.internal.source | crawler | |
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