Publication:

Post ion-implant photoresist removal via wet chemical cleans combined with physical force pretreatments

Date

2007
Proceedings Paper
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dc.contributor.authorTotir, George
dc.contributor.authorFrank, Martin M.
dc.contributor.authorVos, Rita
dc.contributor.authorArnauts, Sophia
dc.contributor.authorBearda, Twan
dc.contributor.authorKenis, Karine
dc.contributor.authorDelande, Tinne
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorKesters, Els
dc.contributor.authorVereecke, Guy
dc.contributor.authorMannaert, Geert
dc.contributor.authorLux, Marcel
dc.contributor.authorHoflijk, Ilse
dc.contributor.authorConard, Thierry
dc.contributor.authorBanerjee,
dc.contributor.authorMalhouitre, Stephane
dc.contributor.authorLeunissen, Peter
dc.contributor.authorMertens, Paul
dc.contributor.imecauthorVos, Rita
dc.contributor.imecauthorArnauts, Sophia
dc.contributor.imecauthorKenis, Karine
dc.contributor.imecauthorDelande, Tinne
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorMannaert, Geert
dc.contributor.imecauthorLux, Marcel
dc.contributor.imecauthorHoflijk, Ilse
dc.contributor.imecauthorConard, Thierry
dc.contributor.imecauthorMertens, Paul
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.contributor.orcidimecConard, Thierry::0000-0002-4298-5851
dc.date.accessioned2021-10-16T20:14:05Z
dc.date.available2021-10-16T20:14:05Z
dc.date.embargo9999-12-31
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12985
dc.source.beginpage219
dc.source.conferenceCleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing 10
dc.source.conferencedate7/10/2007
dc.source.conferencelocationWashington, DC USA
dc.source.endpage226
dc.title

Post ion-implant photoresist removal via wet chemical cleans combined with physical force pretreatments

dc.typeProceedings paper
dspace.entity.typePublication
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