Publication:

Parylene N as a dielectric material for through silicon vias

Date

2008
Proceedings Paper
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dc.contributor.authorMajeed, Bivragh
dc.contributor.authorPham, Nga
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorMajeed, Bivragh
dc.contributor.imecauthorPham, Nga
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-17T08:42:46Z
dc.date.available2021-10-17T08:42:46Z
dc.date.embargo9999-12-31
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14102
dc.source.beginpage1556
dc.source.conference58th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate27/05/2008
dc.source.conferencelocationLake Buena Vista, FL USA
dc.source.endpage1561
dc.title

Parylene N as a dielectric material for through silicon vias

dc.typeProceedings paper
dspace.entity.typePublication
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