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Removal of nano-particles and structural damage in megasonic cleaning of silicon wafers

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dc.contributor.authorVereecke, Guy
dc.contributor.authorHolsteyns, Frank
dc.contributor.authorArnauts, Sophia
dc.contributor.authorKenis, Karine
dc.contributor.authorLux, Marcel
dc.contributor.authorVos, Rita
dc.contributor.authorSnow, Jim
dc.contributor.authorMertens, Paul
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorHolsteyns, Frank
dc.contributor.imecauthorArnauts, Sophia
dc.contributor.imecauthorKenis, Karine
dc.contributor.imecauthorLux, Marcel
dc.contributor.imecauthorVos, Rita
dc.contributor.imecauthorMertens, Paul
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.date.accessioned2021-10-15T17:35:44Z
dc.date.available2021-10-15T17:35:44Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9858
dc.source.conference9th International Symposium on Particles on Surfaces
dc.source.conferencedate16/06/2004
dc.source.conferencelocationPhiladelphia, PA USA
dc.title

Removal of nano-particles and structural damage in megasonic cleaning of silicon wafers

dc.typeOral presentation
dspace.entity.typePublication
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