Publication:

Double and triple stacked solder joint technology for further miniaturization of 3D-SIP

Date

2007
Proceedings Paper
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dc.contributor.authorStoukatch, Serguei
dc.contributor.authorWinters, Christophe
dc.contributor.authorTorfs, Tom
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorBeyne, Eric
dc.contributor.authorVan Hoof, Chris
dc.contributor.imecauthorWinters, Christophe
dc.contributor.imecauthorTorfs, Tom
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.orcidimecTorfs, Tom::0000-0002-1302-3346
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-16T20:02:27Z
dc.date.available2021-10-16T20:02:27Z
dc.date.embargo9999-12-31
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12953
dc.source.beginpage343
dc.source.conference16th European Microelectronics and Packaging Conference and Exhibition - EMPC
dc.source.conferencedate17/06/2007
dc.source.conferencelocationOulu Finland
dc.source.endpage350
dc.title

Double and triple stacked solder joint technology for further miniaturization of 3D-SIP

dc.typeProceedings paper
dspace.entity.typePublication
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