Publication:

Standard SMT process for flip-chip assembly on FR4 substrate

Date

2001
Proceedings Paper
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dc.contributor.authorHarris, S.
dc.contributor.authorPatra, G.
dc.contributor.authorMainwaring, S.
dc.contributor.authorSchols, G.
dc.contributor.authorMathelin, D.
dc.contributor.authorCorlatan, D.
dc.contributor.authorRaedschelders, E.
dc.contributor.authorDe Langhe, Pascal
dc.contributor.authorDe Baets, Johan
dc.contributor.authorVereeken, Maria
dc.contributor.authorVan Calster, Andre
dc.contributor.authorMorrell, M
dc.contributor.authorHaley, C.
dc.contributor.authorOstman, A.
dc.contributor.imecauthorDe Baets, Johan
dc.contributor.imecauthorVan Calster, Andre
dc.date.accessioned2021-10-14T17:01:00Z
dc.date.available2021-10-14T17:01:00Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5335
dc.source.beginpage1
dc.source.conferenceProceedings of the Electronics Assembly Process Exhibition Conference - APEX; January 2001; San Diego, USA.
dc.source.conferencelocation
dc.source.endpage13
dc.title

Standard SMT process for flip-chip assembly on FR4 substrate

dc.typeProceedings paper
dspace.entity.typePublication
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