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Hybrid III-V/Silicon laser based on DVS-BCB die-to-wafer bonding
Publication:
Hybrid III-V/Silicon laser based on DVS-BCB die-to-wafer bonding
Date
2008
Presentation
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17216.pdf
659.43 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Stankovic, Stevan
;
Roelkens, Gunther
;
Van Thourhout, Dries
Journal
Abstract
Description
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Views
1953
since deposited on 2021-10-17
418
item.page.metrics.field.last-week
Acq. date: 2025-10-25
Citations
Metrics
Views
1953
since deposited on 2021-10-17
418
item.page.metrics.field.last-week
Acq. date: 2025-10-25
Citations