Publication:

Non-destructive acoustic metrology and void detection in 3x50μm TSV

Date

2016
Meeting abstract
Simple item page Full metadata Statistics
 
dc.contributor.authorMair, Robin
dc.contributor.authorLiebens, Maarten
dc.contributor.authorMurray, T.
dc.contributor.editorKotelyanskii, M.
dc.contributor.editorMehendale, M.
dc.contributor.editorRu, X.
dc.contributor.editorMukundhan, Priya
dc.contributor.editorKryman, Timothy
dc.contributor.editorVan Huylenbroeck, Stefaan
dc.contributor.editorHaensel, Leander
dc.contributor.editorMiller, Andy
dc.contributor.editorBeyne, Eric
dc.contributor.imecauthorLiebens, Maarten
dc.date.accessioned2021-10-23T12:26:01Z
dc.date.available2021-10-23T12:26:01Z
dc.date.embargo9999-12-31
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26945
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7491103/
dc.source.beginpage54
dc.source.conference27th Annual SEMI Advanced Semiconductor Manufacturing Conference - ASMC
dc.source.conferencedate16/05/2016
dc.source.conferencelocationSaratoga, NY USA
dc.source.endpage59
dc.title

Non-destructive acoustic metrology and void detection in 3x50μm TSV

dc.typeMeeting abstract
dspace.entity.typePublication
Files

Original bundle

Name:
33431.pdf
Size:
1.56 MB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions