Reliability Investigations of Advanced Photosensitive Polymer based RDL Processes Protected by Inorganic Capping Layers

dc.contributor.author	Chery, Emmanuel
dc.contributor.author	Bhatia, Ritwik
dc.contributor.author	Sundaram, Ganesh
dc.contributor.author	Pinho, Nelson
dc.contributor.author	Beyne, Eric
dc.contributor.imecauthor	Chery, Emmanuel
dc.contributor.imecauthor	Pinho, Nelson
dc.contributor.imecauthor	Beyne, Eric
dc.contributor.orcidimec	Chery, Emmanuel::0000-0002-2526-3873
dc.contributor.orcidimec	Pinho, Nelson::0000-0002-0701-5921
dc.contributor.orcidimec	Beyne, Eric::0000-0002-3096-050X
dc.date.accessioned	2025-04-10T15:07:30Z
dc.date.available	2024-12-07T16:57:01Z
dc.date.available	2025-04-10T15:07:30Z
dc.date.issued	2024
dc.identifier.doi	10.1109/ECTC51529.2024.00109
dc.identifier.eisbn	979-8-3503-7598-5
dc.identifier.isbn	979-8-3503-7599-2
dc.identifier.issn	0569-5503
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/44932
dc.publisher	IEEE COMPUTER SOC
dc.source.beginpage	647
dc.source.conference	IEEE 74th Electronic Components and Technology Conference (ECTC)
dc.source.conferencedate	MAY 28-31, 2024
dc.source.conferencelocation	Denver
dc.source.endpage	653
dc.source.journal	N/A
dc.source.numberofpages	7
dc.subject.keywords	COPPER
dc.subject.keywords	AL2O3
dc.subject.keywords	DEPOSITION
dc.subject.keywords	BARRIER
dc.subject.keywords	METAL
dc.title	Reliability Investigations of Advanced Photosensitive Polymer based RDL Processes Protected by Inorganic Capping Layers
dc.type	Proceedings paper
dspace.entity.type	Publication
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