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Backside analysis of ultra-thin film stacks in microelectronics technology using X-ray photoelectron spectroscopy

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dc.contributor.authorHantschel, Thomas
dc.contributor.authorDemeulemeester, Cindy
dc.contributor.authorSuderie, Arnaud
dc.contributor.authorLacave, Thomas
dc.contributor.authorConard, Thierry
dc.contributor.authorVandervorst, Wilfried
dc.contributor.imecauthorHantschel, Thomas
dc.contributor.imecauthorConard, Thierry
dc.contributor.imecauthorVandervorst, Wilfried
dc.contributor.orcidimecHantschel, Thomas::0000-0001-9476-4084
dc.contributor.orcidimecConard, Thierry::0000-0002-4298-5851
dc.date.accessioned2021-10-17T22:42:19Z
dc.date.available2021-10-17T22:42:19Z
dc.date.embargo9999-12-31
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15432
dc.source.beginpageHH08-04
dc.source.conferenceElectron Crystallography for Materials Research and Quantitative Characterization of Nanostructured Materials
dc.source.conferencedate13/04/2009
dc.source.conferencelocationSan Francisco, CA USA
dc.title

Backside analysis of ultra-thin film stacks in microelectronics technology using X-ray photoelectron spectroscopy

dc.typeProceedings paper
dspace.entity.typePublication
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