Particle removal efficiency and damage analysis of patterned wafers in different solvents after megasonic cleaning

dc.contributor.author	Halder, Sandip
dc.contributor.author	Bearda, Twan
dc.contributor.author	Kenis, Karine
dc.contributor.author	Janssens, Tom
dc.contributor.author	Le, Quoc Toan
dc.contributor.author	Wostyn, Kurt
dc.contributor.author	Leunissen, Peter
dc.contributor.author	Mertens, Paul
dc.contributor.imecauthor	Halder, Sandip
dc.contributor.imecauthor	Kenis, Karine
dc.contributor.imecauthor	Le, Quoc Toan
dc.contributor.imecauthor	Wostyn, Kurt
dc.contributor.imecauthor	Mertens, Paul
dc.contributor.orcidimec	Halder, Sandip::0000-0002-6314-2685
dc.contributor.orcidimec	Le, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimec	Wostyn, Kurt::0000-0003-3995-0292
dc.date.accessioned	2021-10-17T07:30:55Z
dc.date.available	2021-10-17T07:30:55Z
dc.date.issued	2008
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/13835
dc.source.conference	11th Iternational Symposium on Particles on Surfaces: Detection, Adhesion and Removal
dc.source.conferencedate	16/07/2008
dc.source.conferencelocation	Orono, ME USA
dc.title	Particle removal efficiency and damage analysis of patterned wafers in different solvents after megasonic cleaning
dc.type	Oral presentation
dspace.entity.type	Publication
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