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A study of microbump metrology and defectivity at 20m pitch and below for 3D TSV stacking

Date

2015
Proceedings Paper
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dc.contributor.authorMiller, Andy
dc.contributor.authorHaensel, Leander
dc.contributor.authorVandeweyer, Tom
dc.contributor.authorBeyne, Eric
dc.contributor.authorWiesiollek, Markus
dc.contributor.authorEisenbach, Heiko
dc.contributor.authorFilzen, Marc
dc.contributor.authorWen, Youxian
dc.contributor.authorSood, Sumant
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorVandeweyer, Tom
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-22T21:05:50Z
dc.date.available2021-10-22T21:05:50Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25645
dc.identifier.urlhttp://www.iwlpc.com/papers/presentations/Ng_Jenny_1.pdf
dc.source.conference13th International Wafer Level Packaging Conference - IWLPC
dc.source.conferencedate13/10/2015
dc.source.conferencelocationSan Jose, CA USA
dc.title

A study of microbump metrology and defectivity at 20m pitch and below for 3D TSV stacking

dc.typeProceedings paper
dspace.entity.typePublication
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