Publication:

Chip-package interaction

Date

2013
Presentation
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dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorVandevelde, Bart
dc.contributor.authorDebecker, Bjorn
dc.contributor.authorIvankovic, Andrej
dc.contributor.authorVanstreels, Kris
dc.contributor.authorGonzalez, Mario
dc.contributor.authorLofrano, Melina
dc.contributor.authorGuo, Wei
dc.contributor.authorCherman, Vladimir
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorGuo, Wei
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.date.accessioned2021-10-21T07:12:55Z
dc.date.available2021-10-21T07:12:55Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22231
dc.source.conferenceIEEE International Reliability Physics Symposium - IRPS
dc.source.conferencedate14/04/2013
dc.source.conferencelocationMonterey, CA USA
dc.title

Chip-package interaction

dc.typeOral presentation
dspace.entity.typePublication
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