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Flip-Chip Montage statt Draht-Bonden
Publication:
Flip-Chip Montage statt Draht-Bonden
Date
2000
Journal article
Simple item page
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4493.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Labie, Riet
;
Beyne, Eric
;
Van Hoof, Rita
;
Honoré, Mia
;
Beerten, Steven
Journal
Produktion von Leiterplatten und Systemen
Abstract
Description
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Views
1994
since deposited on 2021-10-14
413
item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations
Metrics
Views
1994
since deposited on 2021-10-14
413
item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations