Publication:
Characterisation, modelling and design of bond-wire interconnects for chip-package co-design
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1949 since deposited on 2021-10-15
6last month
3last week
Acq. date: 2026-07-28
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Statistics
Views
1949 since deposited on 2021-10-15
6last month
3last week
Acq. date: 2026-07-28
Citations