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Within-die and within-wafer CMP process characterization and monitoring using PWG Fizeau interferometry system

Date

2016
Meeting abstract
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dc.contributor.authorTeugels, Lieve
dc.contributor.authorDevriendt, Katia
dc.contributor.authorHeylen, Nancy
dc.contributor.authorTsvetanova, Diana
dc.contributor.authorStruyf, Herbert
dc.contributor.authorBast, Gerhard
dc.contributor.authorRamkhalawon, Roshita
dc.contributor.authorMueller, Dieter
dc.contributor.authorSimpson, Gavin
dc.contributor.authorUlea, Neli
dc.contributor.imecauthorTeugels, Lieve
dc.contributor.imecauthorDevriendt, Katia
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorTsvetanova, Diana
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorBast, Gerhard
dc.contributor.imecauthorSimpson, Gavin
dc.contributor.orcidimecTeugels, Lieve::0000-0002-6613-9414
dc.contributor.orcidimecDevriendt, Katia::0000-0002-0662-7926
dc.date.accessioned2021-10-23T15:31:19Z
dc.date.available2021-10-23T15:31:19Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27388
dc.identifier.urlhttp://www.canevent.com/upload/microInvite/file/8491/1476432747021046704.pdf
dc.source.conferenceInternational Conference on Planarization Technology - ICPT
dc.source.conferencedate17/10/2016
dc.source.conferencelocationBeijing China
dc.title

Within-die and within-wafer CMP process characterization and monitoring using PWG Fizeau interferometry system

dc.typeMeeting abstract
dspace.entity.typePublication
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