Publication:

Through-silicon via and die stacking technologies for microsystems-integration

Date

2008
Proceedings Paper
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dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Moor, Piet
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorLabie, Riet
dc.contributor.authorJourdain, Anne
dc.contributor.authorTilmans, Harrie
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorSoussan, Philippe
dc.contributor.authorSwinnen, Bart
dc.contributor.authorCartuyvels, Rudi
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorCartuyvels, Rudi
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.date.accessioned2021-10-17T06:18:09Z
dc.date.available2021-10-17T06:18:09Z
dc.date.embargo9999-12-31
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13389
dc.source.beginpage495
dc.source.conferenceTechnical Digest International Electron Devices Meeting - IEDM
dc.source.conferencedate15/12/2008
dc.source.conferencelocationSan Francisco, CA US
dc.source.endpage498
dc.title

Through-silicon via and die stacking technologies for microsystems-integration

dc.typeProceedings paper
dspace.entity.typePublication
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