Publication:
Assessment of the feasibility of 'multiple chips-to-wafer' thermo-compression bonding using FEM
Date
| dc.contributor.author | Okoro, Chukwudi | |
| dc.contributor.author | Jourdain, Anne | |
| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.author | Swinnen, Bart | |
| dc.contributor.author | Vandepitte, Dirk | |
| dc.contributor.imecauthor | Jourdain, Anne | |
| dc.contributor.imecauthor | Vandevelde, Bart | |
| dc.contributor.imecauthor | Swinnen, Bart | |
| dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
| dc.date.accessioned | 2021-10-17T09:28:34Z | |
| dc.date.available | 2021-10-17T09:28:34Z | |
| dc.date.issued | 2008 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/14248 | |
| dc.source.conference | EuroSimE: Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems | |
| dc.source.conferencedate | 20/04/2008 | |
| dc.source.conferencelocation | Freiburg Germany | |
| dc.title | Assessment of the feasibility of 'multiple chips-to-wafer' thermo-compression bonding using FEM | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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