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The bottom-up copper fill of Ø5μm × 40μm vias using 2-component model

Date

2012
Proceedings Paper
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dc.contributor.authorRadisic, Alex
dc.contributor.authorYang, Liu
dc.contributor.authorDrijbooms, Chris
dc.contributor.authorBender, Hugo
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorDrijbooms, Chris
dc.contributor.imecauthorBender, Hugo
dc.date.accessioned2021-10-20T15:01:49Z
dc.date.available2021-10-20T15:01:49Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21366
dc.identifier.urlhttp://www.ecsdl.org/new_ECST
dc.source.beginpage53
dc.source.conferenceProcessing Materials of 3D Interconnects, Damascene and Electronics Packaging
dc.source.conferencedate9/10/2011
dc.source.conferencelocationBoston, MA USA
dc.source.endpage59
dc.title

The bottom-up copper fill of Ø5μm × 40μm vias using 2-component model

dc.typeProceedings paper
dspace.entity.typePublication
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