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Characterization and barrier properties for Cu metallization of tungsten nitride deposited by PECVD using WF6+N2+H2
Publication:
Characterization and barrier properties for Cu metallization of tungsten nitride deposited by PECVD using WF6+N2+H2
Date
1998
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Li, H.
;
Heyvaert, Ilse
;
Jin, S.
;
Lanckmans, Filip
;
Bender, Hugo
;
Maex, Karen
;
Froyen, L.
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1951
since deposited on 2021-10-01
Acq. date: 2025-10-23
Citations
Metrics
Views
1951
since deposited on 2021-10-01
Acq. date: 2025-10-23
Citations