Publication:

Filling of 80 nm structures using a novel copper oxide reduction and reflow approach

Date

2004
Presentation
Simple item page Full metadata Statistics
 
dc.contributor.authorCarbonell, Laure
dc.contributor.authorPalmans, Roger
dc.contributor.authorTravaly, Youssef
dc.contributor.authorBrongersma, Sywert
dc.contributor.authorMaex, Karen
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.date.accessioned2021-10-15T12:49:08Z
dc.date.available2021-10-15T12:49:08Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8652
dc.source.conferenceAdvanced Metallization Conference
dc.source.conferencedate19/10/2004
dc.source.conferencelocationSan Diego, CA USA
dc.title

Filling of 80 nm structures using a novel copper oxide reduction and reflow approach

dc.typeOral presentation
dspace.entity.typePublication
Files
Publication available in collections:
Presentations