Publication:

High-Q inductors and transmission lines on 20O.cm Si using wafer-level packaging technology

Date

2003
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorCarchon, Geert
dc.contributor.authorSun, Xiao
dc.contributor.authorDe Raedt, Walter
dc.contributor.imecauthorSun, Xiao
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.date.accessioned2021-10-15T04:06:08Z
dc.date.available2021-10-15T04:06:08Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7283
dc.source.beginpage111
dc.source.conferenceProceedings of the Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems
dc.source.conferencedate9/04/2003
dc.source.conferencelocationGrainau Germany
dc.source.endpage114
dc.title

High-Q inductors and transmission lines on 20O.cm Si using wafer-level packaging technology

dc.typeProceedings paper
dspace.entity.typePublication
Files
Publication available in collections:
Conference contributions