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Integration of 20nm half pitch single damascene copper trenches by spacer-defined double patterning (SDDP) on metal hard mask (MHM)
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2177 since deposited on 2021-10-18
Acq. date: 2025-10-23
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Views
2177 since deposited on 2021-10-18
Acq. date: 2025-10-23
Citations