Publication:

The realisation of photo-via technology using multiposit as a photo imageable dielectric

Date

1998
Proceedings Paper
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dc.contributor.authorZhang, S.
dc.contributor.authorVereeken, Maria
dc.contributor.authorDe Baets, J.
dc.contributor.authorVan Calster, Andre
dc.contributor.authorPeeters, Joris
dc.contributor.authorAllaert, K.
dc.contributor.imecauthorVan Calster, Andre
dc.date.accessioned2021-10-01T09:52:56Z
dc.date.available2021-10-01T09:52:56Z
dc.date.embargo9999-12-31
dc.date.issued1998
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3171
dc.source.beginpage62
dc.source.conferenceProceedings of the 3rd European Conference on Electronic Packaging Technology and 9th International Conference on Interconnectio
dc.source.conferencedate15/06/1998
dc.source.conferencelocationNuremberg Germany
dc.source.endpage65
dc.title

The realisation of photo-via technology using multiposit as a photo imageable dielectric

dc.typeProceedings paper
dspace.entity.typePublication
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