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Conference contributions
High heat flux dissipation via interposer active micro-cooling
Publication:
High heat flux dissipation via interposer active micro-cooling
Date
2018
Proceedings Paper
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47662.pdf
1.42 MB
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Buja, Federico
;
Zhang, Lei
;
Cherman, Vladimir
;
Oprins, Herman
;
Jones, Ben
;
Soussan, Philippe
Journal
Abstract
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1899
since deposited on 2021-10-25
Acq. date: 2025-10-25
Citations
Metrics
Views
1899
since deposited on 2021-10-25
Acq. date: 2025-10-25
Citations