Publication:

Study of intermetallic compound evolution of pure Sn and SnAg alloy solder on single and multi-layer under-bump materials

Date

2024
Proceedings Paper
https://doi.org/10.1109/ESTC60143.2024.10712073
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dc.contributor.authorHussain, Tassawar
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorCochet, Tom
dc.contributor.authorBeyne, Eric
dc.contributor.authorHsu, Jack
dc.contributor.authorHe, Dongming
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.imecauthorHussain, Tassawar
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorCochet, Tom
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecHussain, Tassawar::0000-0002-8916-7135
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2025-04-16T08:52:09Z
dc.date.available2025-02-15T21:14:00Z
dc.date.available2025-04-16T08:52:09Z
dc.date.issued2024
dc.identifier.doi10.1109/ESTC60143.2024.10712073
dc.identifier.eisbn979-8-3503-9036-0
dc.identifier.isbn979-8-3503-9037-7
dc.identifier.issn2687-9700
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/45214
dc.publisherIEEE
dc.source.conference10th IEEE Electronics System-Integration Technology Conference (ESTC)
dc.source.conferencedateSEP 11-13, 2024
dc.source.conferencelocationBerlin
dc.source.journalN/A
dc.source.numberofpages6
dc.title

Study of intermetallic compound evolution of pure Sn and SnAg alloy solder on single and multi-layer under-bump materials

dc.typeProceedings paper
dspace.entity.typePublication
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