Publication:

Scalability of RuTiN barriers deposited by plasma-enhanced atomic layer deposition for advanced interconnects

Date

2013
Meeting abstract
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dc.contributor.authorSwerts, Johan
dc.contributor.authorSiew, Yong Kong
dc.contributor.authorVan Besien, Els
dc.contributor.authorBarbarin, Yohan
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorTokei, Zsolt
dc.contributor.authorVan Elshocht, Sven
dc.contributor.imecauthorSwerts, Johan
dc.contributor.imecauthorSiew, Yong Kong
dc.contributor.imecauthorVan Besien, Els
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorVan Elshocht, Sven
dc.contributor.orcidimecVan Besien, Els::0000-0002-5174-2229
dc.contributor.orcidimecVan Elshocht, Sven::0000-0002-6512-1909
dc.date.accessioned2021-10-21T12:30:21Z
dc.date.available2021-10-21T12:30:21Z
dc.date.embargo9999-12-31
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23140
dc.source.beginpage255
dc.source.conferenceMaterials for Advanced Metallization - MAM
dc.source.conferencedate10/03/2013
dc.source.conferencelocationLeuven Belgium
dc.source.endpage256
dc.title

Scalability of RuTiN barriers deposited by plasma-enhanced atomic layer deposition for advanced interconnects

dc.typeMeeting abstract
dspace.entity.typePublication
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