Publication:
Thickness characterization of ultra thin wafers on carrier
Date
| dc.contributor.author | Cotrin Teixeira, Ricardo | |
| dc.contributor.author | De Munck, Koen | |
| dc.contributor.author | Baert, Kris | |
| dc.contributor.author | Swinnen, Bart | |
| dc.contributor.author | Knüttel, Alexsander | |
| dc.contributor.author | De Moor, Piet | |
| dc.contributor.imecauthor | De Munck, Koen | |
| dc.contributor.imecauthor | Swinnen, Bart | |
| dc.contributor.imecauthor | De Moor, Piet | |
| dc.date.accessioned | 2021-10-16T15:23:43Z | |
| dc.date.available | 2021-10-16T15:23:43Z | |
| dc.date.issued | 2007-12 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/11906 | |
| dc.source.beginpage | 238 | |
| dc.source.conference | 9th Electronics Packaging Technology Conference - EPTC | |
| dc.source.conferencedate | 10/12/2007 | |
| dc.source.conferencelocation | Singapore | |
| dc.source.endpage | 241 | |
| dc.title | Thickness characterization of ultra thin wafers on carrier | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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