Publication:

Key elements for sub-50μm pitch micro bump processes

Date

2013
Proceedings Paper
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dc.contributor.authorDe Vos, Joeri
dc.contributor.authorBogaerts, Lieve
dc.contributor.authorBuisson, Thibault
dc.contributor.authorGerets, Carine
dc.contributor.authorJamieson, Geraldine
dc.contributor.authorVandersmissen, Kevin
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorBogaerts, Lieve
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorJamieson, Geraldine
dc.contributor.imecauthorVandersmissen, Kevin
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecJamieson, Geraldine::0000-0002-6750-097X
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-21T07:12:13Z
dc.date.available2021-10-21T07:12:13Z
dc.date.embargo9999-12-31
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22227
dc.source.beginpage1122
dc.source.conference63rd Electronic Components and Technology Conference - ECTC
dc.source.conferencedate28/05/2013
dc.source.conferencelocationLas Vegas, NV USA
dc.source.endpage1126
dc.title

Key elements for sub-50μm pitch micro bump processes

dc.typeProceedings paper
dspace.entity.typePublication
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