Plasma enhanced chemical vapor deposition of manganese on low-k dielectrics for copper diffusion barrier application

dc.contributor.author	Jourdan, Nicolas
dc.contributor.author	Barbarin, Yohan
dc.contributor.author	Croes, Kristof
dc.contributor.author	Siew, Yong Kong
dc.contributor.author	Van Elshocht, Sven
dc.contributor.author	Tokei, Zsolt
dc.contributor.author	Vancoille, Eric
dc.contributor.imecauthor	Jourdan, Nicolas
dc.contributor.imecauthor	Croes, Kristof
dc.contributor.imecauthor	Siew, Yong Kong
dc.contributor.imecauthor	Van Elshocht, Sven
dc.contributor.imecauthor	Tokei, Zsolt
dc.contributor.imecauthor	Vancoille, Eric
dc.contributor.orcidimec	Croes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimec	Van Elshocht, Sven::0000-0002-6512-1909
dc.date.accessioned	2021-10-21T08:37:24Z
dc.date.available	2021-10-21T08:37:24Z
dc.date.issued	2013
dc.identifier.issn	2162-8726
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/22558
dc.source.beginpage	25
dc.source.endpage	27
dc.source.issue	3
dc.source.journal	ECS Solid State Letters
dc.source.volume	2
dc.title	Plasma enhanced chemical vapor deposition of manganese on low-k dielectrics for copper diffusion barrier application
dc.type	Journal article
dspace.entity.type	Publication
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