Publication:
Challenges and opportunities for stacking ICs
Date
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-22T00:46:24Z | |
| dc.date.available | 2021-10-22T00:46:24Z | |
| dc.date.issued | 2014 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/23544 | |
| dc.source.conference | 3D TSV Integration Workshop, Semiconductor Society IEIE and IEEE-CAS, Kyung Hee University | |
| dc.source.conferencedate | 25/09/2014 | |
| dc.source.conferencelocation | Suwon Korea | |
| dc.title | Challenges and opportunities for stacking ICs | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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