Influence of low-k dry etch chemistries on the properties of Copper and a TA-based diffusion barrier

dc.contributor.author	Ernur, Didem
dc.contributor.author	Iacopi, Francesca
dc.contributor.author	Carbonell, Laure
dc.contributor.author	Struyf, Herbert
dc.contributor.author	Maex, Karen
dc.contributor.imecauthor	Ernur, Didem
dc.contributor.imecauthor	Struyf, Herbert
dc.contributor.imecauthor	Maex, Karen
dc.date.accessioned	2021-10-15T04:38:40Z
dc.date.available	2021-10-15T04:38:40Z
dc.date.issued	2003
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/7556
dc.source.beginpage	285
dc.source.endpage	292
dc.source.issue	2_4
dc.source.journal	Microelectronic Engineering
dc.source.volume	70
dc.title	Influence of low-k dry etch chemistries on the properties of Copper and a TA-based diffusion barrier
dc.type	Journal article
dspace.entity.type	Publication
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