Publication:
Impact of Back-End-Of-Line architecture on Chip-Package-Interaction in advanced interconnects using shear microprobing and finite element simulations
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1838 since deposited on 2021-10-26
4last month
Acq. date: 2025-12-16
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Views
1838 since deposited on 2021-10-26
4last month
Acq. date: 2025-12-16
Citations