Publication:

Fine pitch 3D-TSV based high frequency components for RF MEMS applications

Date

2015
Proceedings Paper
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Author(s)

Vitale, Wolfgang
;
Fernández-Bolaños, Montserrat
;
Merkel, Reinhart
;
Enayati, Amin
;
Ocket, Ilja  
;
De Raedt, Walter  
;
Weber, Josef
;
Ramm, Peter
;
Ionescu, Adrian M.

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