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Articles
On the thermal machanical behaviors of a novel nanowire based anisotropic conductive film technology
Publication:
On the thermal machanical behaviors of a novel nanowire based anisotropic conductive film technology
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Date
2009
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Cheng, Hsien-Chie
;
Chen, Wen-Hwa
;
Lin, Chieh-Sheng
;
Hsu, Yung-Yu
;
Uang, Ruoh-Huey
Journal
IEEE Transactions on Advanced Packaging
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1934
since deposited on 2021-10-17
1
last month
Acq. date: 2025-12-11
Citations
Metrics
Views
1934
since deposited on 2021-10-17
1
last month
Acq. date: 2025-12-11
Citations