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Copper seed layer scaling for advanced interconnects: extendibility of I-PVD
Publication:
Copper seed layer scaling for advanced interconnects: extendibility of I-PVD
Date
2003
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Tokei, Zsolt
;
Demuynck, Steven
;
Vervoort, Iwan
;
Mebarki, Bencherki
;
Mandrekar, T.
;
Guggilla, S.
;
Maex, Karen
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1953
since deposited on 2021-10-15
Acq. date: 2025-10-23
Citations
Metrics
Views
1953
since deposited on 2021-10-15
Acq. date: 2025-10-23
Citations