Publication:
Stackable memory of 3D chip integration for mobile applications
Date
| dc.contributor.author | Gu, S.Q. | |
| dc.contributor.author | Marchal, Pol | |
| dc.contributor.author | Facchini, Marco | |
| dc.contributor.author | Wang, F. | |
| dc.contributor.author | Suh, M. | |
| dc.contributor.author | Lisk, D. | |
| dc.contributor.author | Nowak, M. | |
| dc.date.accessioned | 2021-10-17T07:27:33Z | |
| dc.date.available | 2021-10-17T07:27:33Z | |
| dc.date.issued | 2008 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/13821 | |
| dc.source.beginpage | 813 | |
| dc.source.conference | IEEE International Electron Devices Meeting - IEDM | |
| dc.source.conferencedate | 15/12/2008 | |
| dc.source.conferencelocation | San Francisco, CA USA | |
| dc.source.endpage | 816 | |
| dc.title | Stackable memory of 3D chip integration for mobile applications | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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