Publication:

Study of Au/In reaction for transient liquid phase bonding and 3D chip stacking

Date

2008
Journal article
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dc.contributor.authorZhang, Wenqi
dc.contributor.authorRuythooren, Wouter
dc.contributor.imecauthorRuythooren, Wouter
dc.date.accessioned2021-10-17T13:07:59Z
dc.date.available2021-10-17T13:07:59Z
dc.date.embargo9999-12-31
dc.date.issued2008
dc.identifier.issn0361-5235
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14836
dc.source.beginpage1095
dc.source.endpage1011
dc.source.issue8
dc.source.journalJournal of Electronic Materials
dc.source.volume37
dc.title

Study of Au/In reaction for transient liquid phase bonding and 3D chip stacking

dc.typeJournal article
dspace.entity.typePublication
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