Publication:
A highly reliable 1.4μm pitch via-last TSV module for wafer-to-wafer hybrid bonded 3D-SOC systems
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2063 since deposited on 2021-10-27
Acq. date: 2026-02-24
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Statistics
Views
2063 since deposited on 2021-10-27
Acq. date: 2026-02-24
Citations