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Correlation between barrier integrity and TDDB performance of copper porous low-k interconnects
Publication:
Correlation between barrier integrity and TDDB performance of copper porous low-k interconnects
Date
2004
Journal article
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Tokei, Zsolt
;
Patz, Matthias
;
Schmidt, Michael
;
Iacopi, Francesca
;
Demuynck, Steven
;
Maex, Karen
Journal
Microelectronic Engineering
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1914
since deposited on 2021-10-15
Acq. date: 2025-10-23
Citations
Metrics
Views
1914
since deposited on 2021-10-15
Acq. date: 2025-10-23
Citations