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Evaluation of Mn-based Cu barriers for interconnect applications

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dc.contributor.authorVan Besien, Els
dc.contributor.authorJourdan, Nicolas
dc.contributor.authorZhao, Larry
dc.contributor.authorCroes, Kristof
dc.contributor.authorSiew, Yong Kong
dc.contributor.authorVan Elshocht, Sven
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorVan Besien, Els
dc.contributor.imecauthorJourdan, Nicolas
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorSiew, Yong Kong
dc.contributor.imecauthorVan Elshocht, Sven
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecVan Besien, Els::0000-0002-5174-2229
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecVan Elshocht, Sven::0000-0002-6512-1909
dc.date.accessioned2021-10-19T20:09:32Z
dc.date.available2021-10-19T20:09:32Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19949
dc.identifier.urlhttp://www.avssymposium.org/
dc.source.conferenceAVS 58th International Symposium and Exhibition
dc.source.conferencedate30/10/2011
dc.source.conferencelocationNashville, TN USA
dc.title

Evaluation of Mn-based Cu barriers for interconnect applications

dc.typeOral presentation
dspace.entity.typePublication
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