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High depth resolution characterization of the damage and annealing behaviour of ultrashallow As-implants in Si
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High depth resolution characterization of the damage and annealing behaviour of ultrashallow As-implants in Si
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Date
2002
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
van den Berg, J.A.
;
Armour, D.G.
;
Werner, M.
;
Whelan, S.
;
Vandervorst, Wilfried
;
Clarysse, Trudo
;
Collart, E.H.J.
;
Goldberg, R.D.
;
Bailey, P.
;
Noakes, T.C.Q.
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1871
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Views
1871
since deposited on 2021-10-14
1
last month
1
last week
Acq. date: 2025-12-10
Citations