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Conference contributions
Role of oxygen and cuprous ions in copper electroplating
Publication:
Role of oxygen and cuprous ions in copper electroplating
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Date
2013-03
Meeting abstract
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26573.pdf
1.03 MB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Yang, Liu
;
Marchal, Wouter
;
Radisic, Alex
;
Deconinck, Johan
;
Vereecken, Philippe
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Abstract
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1950
since deposited on 2021-10-21
Acq. date: 2025-12-12
Citations
Metrics
Views
1950
since deposited on 2021-10-21
Acq. date: 2025-12-12
Citations