3D stacking of ultra-thin chip packages: an innovative packaging and interconnection technology

dc.contributor.author	Priyabadini, Swarnakamal
dc.contributor.author	Sterken, Tom
dc.contributor.author	Van Hoorebeke, Luc
dc.contributor.author	Vanfleteren, Jan
dc.contributor.imecauthor	Sterken, Tom
dc.contributor.imecauthor	Vanfleteren, Jan
dc.contributor.orcidimec	Vanfleteren, Jan::0000-0002-9654-7304
dc.date.accessioned	2021-10-21T11:06:48Z
dc.date.available	2021-10-21T11:06:48Z
dc.date.embargo	9999-12-31
dc.date.issued	2013-07
dc.identifier.issn	1521-3331
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/22957
dc.identifier.url	http://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6410397&queryText%3D3D+stacking+of+ultra-thin+chip+packages%3A+an
dc.source.beginpage	1144
dc.source.endpage	1122
dc.source.journal	IEEE Transactions on Components and Packaging Technologies
dc.source.volume	3
dc.title	3D stacking of ultra-thin chip packages: an innovative packaging and interconnection technology
dc.type	Journal article
dspace.entity.type	Publication
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